South Burlington, VT, United States of America

Tian Xia

This inventor holds 5 USPTO granted patents and 5 published patent applications. Top assignees: Marvell Asia Pte., Ltd., University of Vermont, The University of Vermont and State Agricultural College. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tian Xia. Retrieved from https://idiyas.com/inventor/tian-xia-87nacvef

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 100.0

Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020-2026

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5 patents (USPTO):Explore Patents

Title: Innovations of Inventor Tian Xia

Introduction

Tian Xia is a prominent inventor based in South Burlington, Vermont, recognized for his innovative contributions to technology and electronics. With a total of three patents to his name, Tian has made significant strides in improving device security and subsurface imaging technology. His work reflects a deep commitment to advancing the field of electronics, particularly in enhancing the security protocols of semiconductor devices.

Latest Patents

Among Tian Xia's notable patents is the "Method and apparatus for self-destruction of device protected by a physical unclonable function generator." This innovation addresses unauthorized access to information in semiconductor devices by implementing a security protocol that, upon receiving a verified inaccessibility-inducing signal, unlocks safety lock circuitry. This system is designed to prevent unintentional activation of self-destruction, thus safeguarding sensitive information housed within the semiconductor device.

Additionally, Tian has developed a "Wideband ground penetrating radar system and method," which enhances traditional Ground Penetrating Radar (GPR) systems. This advanced system employs full waveform digitization to significantly decrease the number of launch signals while staying within the radiation limits set by the Federal Communications Commission (FCC). The system also features large latent-duty-cycle sampling, making it cost-effective and scalable for multi-antenna testing, which is crucial for subsurface tomographic imaging.

Career Highlights

Throughout his career, Tian Xia has held positions at reputable institutions, including the University of Vermont and State Agricultural College and Marvell Asia Pte., Ltd. His experiences at these organizations have enabled him to bridge the gap between academic research and practical applications in industry.

Collaborations

In his innovative endeavors, Tian has collaborated with notable professionals such as Dryver R Huston and Dylan Burns. These partnerships have furthered his projects and contributed to developing revolutionary technologies within the fields of electronics and security systems.

Conclusion

Tian Xia's work exemplifies the spirit of innovation and dedication to improving technology for better security and efficiency. His patents not only reflect significant advancements in semiconductor technology but also serve as a testament to the collaborative efforts within the research community. As an inventor, Tian continues to inspire future generations in the realm of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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