Tian Shi

Title: Innovations by Inventor Tian Shi

Introduction

Tian Shi is a notable inventor based in Fremont, CA, who has made significant contributions to the field of optical testing. With a total of 2 patents, his work focuses on enhancing the efficiency and effectiveness of testing optical components.

Latest Patents

One of Tian Shi's latest patents is a "Probe tip assembly for testing optical components." This invention includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly consists of multiple probe tips, with at least one extending beyond the end of the PCBA. This configuration allows for the transmission of electric signals to test optical components. The materials used for the probe tips include copper (Cu), beryllium copper (BeCu) alloy, tungsten (W), and other conductive materials.

Another significant patent is the "Wafer prober to facilitate testing of a wafer using nanosecond pulses." This wafer testing system comprises a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck holds the wafer carrier, which in turn holds the wafer. The cathode plate provides an electrical connection between the wafer carrier and the probe card, enabling effective testing of the wafer using the associated probes.

Career Highlights

Tian Shi is currently employed at Lumentum Operations LLC, where he continues to innovate and develop new technologies in optical testing. His expertise and contributions have positioned him as a valuable asset in his field.

Collaborations

Tian has collaborated with talented coworkers such as Yuanzhen Zhuang and Lucas Morales, further enhancing the innovative environment at Lumentum Operations LLC.

Conclusion

Tian Shi's work in optical testing through his patents demonstrates his commitment to advancing technology in this field. His contributions are paving the way for more efficient testing methods, showcasing the importance of innovation in engineering.