Shenzhen, China

Ti Iiang Hou

This inventor holds 1 USPTO granted patent. Top assignee: Amcrest Global Holdings Limited. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ti Iiang Hou. Retrieved from https://idiyas.com/inventor/ti-iiang-hou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 42(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Ti Iiang Hou: Innovator in Doorbell Technology

Introduction

Ti Iiang Hou is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of technology, particularly with his innovative designs. His work has led to the development of a unique doorbell, showcasing his creativity and technical skills.

Latest Patents

Ti Iiang Hou holds a patent for a doorbell, which reflects his commitment to enhancing everyday technology. This invention is a testament to his ability to identify and address common needs in modern households. He has 1 patent to his name, highlighting his innovative spirit.

Career Highlights

Currently, Ti Iiang Hou is employed at Amcrest Global Holdings Limited, a company known for its advancements in security and surveillance technology. His role at Amcrest allows him to further explore his passion for innovation and contribute to the development of cutting-edge products.

Collaborations

Throughout his career, Ti Iiang Hou has worked alongside talented individuals such as Raheel Nusratullah and Tahir Ravat. These collaborations have enriched his experience and fostered a creative environment for innovation.

Conclusion

Ti Iiang Hou is a dedicated inventor whose work in doorbell technology exemplifies his innovative mindset. His contributions to Amcrest Global Holdings Limited and his collaborations with fellow inventors further enhance his impact in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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