Bern, Switzerland

Thorsten Hauk

This inventor holds 1 USPTO granted patent and 1 published patent application and 3 EPO patents. Top assignee: Vsl International Ag. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Thorsten Hauk. Retrieved from https://idiyas.com/inventor/thorsten-hauk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Thorsten Hauk: Innovator in Thermal Protection Technology

Introduction

Thorsten Hauk is a notable inventor based in Bern, Switzerland. He has made significant contributions to the field of thermal protection technology. His innovative approach has led to the development of a unique solution for covering elongated structural elements.

Latest Patents

Thorsten Hauk holds a patent for a cylindrical thermal protection sheath. This invention features a sandwich-like composite insulation system. It is designed to maintain a thermal conductivity of 0.11 W/m.°C or lower at temperatures reaching 800°C. The sheath has a thickness of less than 50 millimeters, making it an efficient solution for thermal insulation.

Career Highlights

Hauk is currently employed at VSL International AG, where he continues to work on advancements in thermal protection technologies. His expertise and innovative mindset have positioned him as a key player in his field.

Collaborations

Throughout his career, Thorsten has collaborated with talented individuals such as Daniel Knight and Mark Rebentrost. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Thorsten Hauk's contributions to thermal protection technology exemplify the impact of innovative thinking in engineering. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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