Heidelberg, Germany

Thorsten Frank

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Carl Freudenberg Kg. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Thorsten Frank. Retrieved from https://idiyas.com/inventor/thorsten-frank-8tnhay0o

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile



Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Thorsten Frank - Innovator in Three-Dimensional Moulded Planar Cables

Introduction

Thorsten Frank is a notable inventor based in Heidelberg, Germany. He has made significant contributions to the field of cable technology, particularly with his innovative designs and methods.

Latest Patents

Thorsten Frank holds a patent for a three-dimensional moulded planar cable. This invention includes a laminate made from at least one conductor track, which is bonded between two insulation layers and at least one support layer. The layers are connected by an adhesive layer. The cable is shaped using a positive moulding tool, and the final form is achieved through the application of heat, radiation, or pressure. The three-dimensional shape is fixed by cooling below the glass temperature of the adhesive layer or by hardening the adhesive layer.

Career Highlights

Thorsten Frank is associated with Carl Freudenberg KG, where he continues to develop and refine his innovative ideas. His work has been instrumental in advancing cable technology, making it more efficient and versatile.

Collaborations

Thorsten collaborates with Denis Reibel, contributing to the development of new technologies and innovations in their field.

Conclusion

Thorsten Frank's contributions to the field of cable technology through his patent for a three-dimensional moulded planar cable exemplify his innovative spirit and dedication to advancing engineering solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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