Tukwila, WA, United States of America

Thompson Nguyen

This inventor holds 1 USPTO granted patent. Top assignee: The Boeing Company. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Thompson Nguyen. Retrieved from https://idiyas.com/inventor/thompson-nguyen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Thompson Nguyen: Innovator in Adhesive Technology

Introduction

Thompson Nguyen is a notable inventor based in Tukwila, WA (US). He has made significant contributions to the field of adhesive technology, particularly through his innovative patent. His work is characterized by a focus on improving bonding methods in various applications.

Latest Patents

Thompson Nguyen holds a patent for a "Bondline control adhesive spacer." This invention discloses a method of bonding a first part to a second part to form an assembly. The method involves positioning a plurality of adhesive spacers made of a first curable adhesive in a cured state between the two parts. Additionally, at least one adhesive layer is positioned between the spacers and each part, made of the same adhesive in a non-cured state. The process culminates in curing the assembly, ensuring a strong bond.

Career Highlights

Thompson Nguyen is currently employed at The Boeing Company, where he applies his expertise in adhesive technologies. His innovative approach has contributed to advancements in the aerospace industry, enhancing the reliability and efficiency of various components.

Collaborations

Thompson has collaborated with notable colleagues, including Michael Walter Evens and Richard A. Binder. These partnerships have fostered a creative environment that encourages the development of cutting-edge solutions in adhesive technology.

Conclusion

Thompson Nguyen's contributions to adhesive technology through his patent and work at The Boeing Company highlight his role as an innovator in the field. His dedication to improving bonding methods continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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