This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2004-2005.
Company Filing History:
Years Active: 2004-2005
Title: Thomas W. Dalrymple: Innovator in Semiconductor Technology
Introduction
Thomas W. Dalrymple is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative methods to enhance the performance and reliability of semiconductor devices.
Latest Patents
Dalrymple's latest patents include a module with adhesively attached heat sink. This invention describes a method and structure to adhesively couple a cover plate to a semiconductor device. In this design, a semiconductor device is electrically coupled to a substrate. A stiffener ring surrounds the semiconductor device and is adhesively coupled to the substrate. The cover plate is adhesively coupled to both the top surface of the semiconductor device and the top surface of the stiffener ring using a first and second adhesive, respectively. Notably, the modulus of the first adhesive is less than the modulus of the second adhesive, which is crucial for the device's performance.
Career Highlights
Dalrymple is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in the semiconductor field. His work at IBM has allowed him to collaborate with some of the brightest minds in the industry.
Collaborations
Some of his notable coworkers include David James Alcoe and Michael A. Gaynes. Their collaborative efforts contribute to the advancement of technology within the company.
Conclusion
Thomas W. Dalrymple's contributions to semiconductor technology through his patents and work at IBM highlight his role as an influential inventor. His innovative approaches continue to shape the future of the industry.