Company Filing History:
Years Active: 2010-2011
Title: Thomas Stortini: Innovator in Integrated Circuit Packaging
Introduction
Thomas Stortini is a notable inventor based in Fremont, CA (US). He holds 2 patents that showcase his contributions to the field of integrated circuit packaging. His innovative designs have significantly impacted the efficiency and cost-effectiveness of electronic components.
Latest Patents
One of Thomas Stortini's latest patents involves a press-fit integrated circuit package that utilizes compressed spring contact beams. This invention features an insulative substrate equipped with flexible retaining clips and alignment pins. A metal leadframe with multiple leads is attached to the substrate, where each lead terminates in a spring contact beam portion. The integrated circuit is press-fit through the retaining clips, ensuring that the pads on the circuit's face side compress the spring contact beams. This assembly is then encapsulated, and the leads are singulated and formed into the desired shape. This low-cost packaging method eliminates the need for wire-bonding and flip-chip bond bump forming steps, streamlining the manufacturing process.
Career Highlights
Throughout his career, Thomas Stortini has worked with several prominent companies, including Zilog, Inc. and IXYS Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects in the electronics industry.
Collaborations
Thomas has collaborated with notable professionals in his field, including his coworker John A. Ransom. Their joint efforts have led to advancements in integrated circuit technology and packaging solutions.
Conclusion
Thomas Stortini's work in integrated circuit packaging exemplifies innovation and efficiency in electronics. His patents reflect a commitment to improving manufacturing processes and reducing costs in the industry.