Company Filing History:
Years Active: 2014-2017
Title: Innovations by Thomas Rohleder in Integrated Circuit Technology
Introduction
Thomas Rohleder is a prominent inventor based in Hamburg, Germany. He has made significant contributions to the field of integrated circuit technology, holding a total of 6 patents. His work focuses on advanced methods for preparing integrated circuit devices, showcasing his expertise and innovative thinking.
Latest Patents
Rohleder's latest patents include groundbreaking methods such as "Plasma dicing with blade saw patterned underside mask." This method involves preparing an integrated circuit device from a wafer substrate by coating the underside surface with a resilient coating and plasma etching through trenches to remove exposed bulk material. Another notable patent is "Combination grinding after laser (GAL) and laser on-off function to increase die strength." This method enhances the strength of IC device die by utilizing a two-step laser process and precise grinding techniques.
Career Highlights
Throughout his career, Rohleder has been associated with NXP B.V., a leading company in the semiconductor industry. His innovative approaches have contributed to the advancement of integrated circuit technologies, making him a valuable asset in his field.
Collaborations
Rohleder has collaborated with notable colleagues such as Hartmut Buenning and Guido Albermann. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Thomas Rohleder's contributions to integrated circuit technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor technology, showcasing the importance of innovation in driving progress.