This inventor holds 1 USPTO granted patent. Top assignee: Mannesmann Kienzle Gmbh. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001
Title: Thomas Lindner - Innovator in Substrate Bonding Technology
Introduction
Thomas Lindner is a notable inventor based in Koenigsfeld, Germany. He has made significant contributions to the field of substrate bonding technology. His innovative approach has led to the development of a unique method and device that enhances the efficiency of bonding multilayered substrate packages.
Latest Patents
Lindner holds a patent for a "Method and device for stacking substrates which are to be joined by bonding." This invention proposes a method and apparatus designed to bond multilayered substrate packages over a large surface with uniform heating in a single work step. The structured substrates are aligned with high precision in a working area separate from the heating apparatus, ensuring optimal results.
Career Highlights
Thomas Lindner is associated with Mannesmann Kienzle GmbH, where he has been instrumental in advancing substrate bonding technologies. His work has not only improved manufacturing processes but has also set new standards in the industry.
Collaborations
Lindner collaborates with Horst Plankenhorn, a fellow innovator in the field. Their partnership has fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Thomas Lindner's contributions to substrate bonding technology exemplify the impact of innovation in manufacturing processes. His patent and collaborative efforts continue to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile