Thomas J Moloney

Title: Thomas J Moloney: Innovator in Wafer Scale Packaging

Introduction

Thomas J Moloney is a notable inventor based in Ellicott City, MD (US). He has made significant contributions to the field of electronic packaging, particularly through his innovative designs and methods. With a total of 2 patents, his work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is focused on a wafer scale package and method of assembly. This invention involves a plurality of electronic circuits and associated signal lines positioned at respective locations on a base wafer. A cover wafer fits over the base wafer and includes a corresponding number of locations, each with one or more cavities to accommodate the electronic circuits and signal lines. The cover wafer also features a plurality of vias for making electrical connections to the signal lines. A multi-layer metallic arrangement hermetically seals the periphery of each location and the bottom of each via. The joined base and cover wafers can then be diced to form individual die packages.

Career Highlights

Thomas J Moloney is currently employed at Northrop Grumman Systems Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of electronic packaging solutions.

Collaborations

Throughout his career, Thomas has collaborated with talented individuals such as Li-shu Chen and Philip C Smith. These collaborations have further enhanced the quality and impact of his inventions.

Conclusion

Thomas J Moloney is a distinguished inventor whose work in wafer scale packaging has paved the way for advancements in electronic circuit assembly. His contributions continue to influence the industry and inspire future innovations.