This inventor holds 4 USPTO granted patents. Top assignees: Diamond Shamrock Corporation, Other. Active years: 1977-1988.
Location History:
- Madison, OH (US) (1977 - 1978)
- Euclid, OH (US) (1982 - 1988)
Company Filing History:
Years Active: 1977-1988
Title: Thomas G Strempel: Innovator in Electroplating Technologies
Introduction
Thomas G Strempel is a notable inventor based in Madison, OH (US), recognized for his contributions to electroplating technologies. With a total of 4 patents to his name, Strempel has made significant advancements in the field, particularly in the application of electroplating processes.
Latest Patents
Strempel's latest patents include an innovative anodic belt electroplating apparatus. This apparatus utilizes a flexible, electrolyte permeable belt anode with a porous outer belt covering, allowing for flexible operational parameters. The perforate belt anode, made of valve metal in mesh form, features an electrocatalytic coating and an electrolyte-containing wrap for the outer belt covering. This design enables the electroplating of metal coils in strip form through a substantially flat and horizontal electroplate zone, achieving highly desirable plating speeds while maintaining careful control over plate composition and deposition thickness. Another significant patent involves an electrolytic process for converting alkali metal carbonates to alkali metal hydroxides at high current efficiencies.
Career Highlights
Throughout his career, Strempel has worked with various companies, including Diamond Shamrock Corporation. His work has focused on enhancing electroplating techniques and improving the efficiency of related processes.
Collaborations
Strempel has collaborated with notable individuals in the field, including Charles J Hora and Terry E Dorsett. These collaborations have contributed to the development and refinement of his innovative technologies.
Conclusion
Thomas G Strempel's work in electroplating technologies showcases his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving efficiency and effectiveness in electroplating processes.