Thomas E Pearson

Title: Thomas E Pearson: Innovator in Microelectronic Device Packaging

Introduction

Thomas E Pearson is a notable inventor based in Beaverton, OR (US). He has made significant contributions to the field of microelectronics, particularly in the area of device packaging. His innovative work has led to the development of a unique patent that enhances the functionality and efficiency of microelectronic devices.

Latest Patents

Thomas E Pearson holds a patent for an "Interposer to couple a microelectronic device package to a circuit board." This invention involves a PCB substrate that is designed to facilitate the connection between microelectronic device packages and motherboards. The process includes drilling multiple via holes through a copper-clad PCB substrate, which are then coated with copper. The copper surface is etched to create multiple traces. In one embodiment, the substrate is cut to produce individual beam-and-trace interposers, which can be combined to form an interposer array. Alternatively, the substrate may remain intact, with each via hole filled with a conductive material to create solid conductive columns.

Career Highlights

Thomas E Pearson is associated with Intel Corporation, where he has contributed to various projects and innovations in microelectronics. His work has been instrumental in advancing the technology used in electronic devices, making them more efficient and reliable.

Collaborations

Throughout his career, Thomas has collaborated with several talented individuals, including George L Arrigotti and Raiyomand F Aspandiar. These collaborations have fostered a creative environment that has led to groundbreaking advancements in the field.

Conclusion

Thomas E Pearson's contributions to microelectronic device packaging exemplify the spirit of innovation. His patent and work at Intel Corporation highlight his commitment to advancing technology in this critical field.