Company Filing History:
2 out of 39,230 
1 out of 1 Years Active: 1999-2000
Title: Innovations by Thomas E. Molinaro: Pioneering Solder Bump Techniques
Introduction
Thomas E. Molinaro, an innovative inventor based in Newark, California, has made significant contributions to the field of electronics through his patented inventions. With a total of two patents, Molinaro focuses on advanced methods and apparatuses for creating solder bumps on integrated circuit chips, which are essential for reliable electronic connections.
Latest Patents
Molinaro's latest patented innovations include "Captured-cell solder printing and reflow methods and apparatuses." This invention describes methods and apparatuses for forming solder bumps on integrated circuit chips and similar circuitized units. The process involves laying a screening stencil over the substrate surface, followed by the deposition of solder paste material into the stencil's apertures using a screening blade. By positioning the stencil so that its apertures are aligned with the substrate pads where solder bumps will be formed, and applying a flat pressure plate, a fully enclosed "captured" cell of solder paste is created within each aperture. After heating the substrate to the appropriate temperature to reflow the solder paste, the substrate is cooled, and the stencil and pressure plate are removed, leaving behind perfectly formed solder bumps. This method is particularly advantageous for achieving high densities of solder bumps, suitable for smaller sizes and closer pitch distances.
Career Highlights
Throughout his career, Molinaro has worked with several prominent companies, including Fujitsu Corporation and Semi-Pac. His roles at these companies enabled him to develop and refine his innovative techniques in the electronics industry, leading to his notable patent achievements.
Collaborations
Molinaro has collaborated with industry peers such as John T. MacKay and David G. Love. These collaborations have fostered a rich exchange of ideas and technological advancements, further enhancing the impact of Molinaro's inventions on the field.
Conclusion
Thomas E. Molinaro stands out as a significant figure in the innovation of solder bump technologies for integrated circuits. His contributions not only advance the capabilities of electronic manufacturing but also pave the way for future advancements in the industry. With his patented methods gaining recognition, Molinaro's work continues to influence the electronics sector and inspire new generations of inventors.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.