Company Filing History:
Years Active: 2007
Title: Thomas C Bristow: Innovator in Wafer Thickness Measurement
Introduction
Thomas C Bristow is a notable inventor based in Rochester, NY (US). He has made significant contributions to the field of non-contact measurement technologies, particularly in the area of wafer thickness measurement. With a total of 2 patents to his name, Bristow's work has advanced the precision and efficiency of measuring techniques in various applications.
Latest Patents
Bristow's latest patents include innovative methods and apparatuses for measuring wafer thickness. The first patent describes a system that utilizes a laser beam split into two identical directly opposed input beams. This system allows for the non-contact measurement of the thickness of a test object. A calibration object of known thickness reflects the beams from the sides of the test object. Each reflected beam passes through sensing means, including a pinhole aperture and a photodiode sensor. The maximum sensor output defines focal points a known distance apart. By determining the deviation of the test object's reflecting surfaces from the calibration object's surfaces, the thickness can be accurately determined.
The second patent also focuses on a non-contact measurement system for determining the thickness of an object. Similar to the first, it employs a laser beam split into two identical input beams. A calibration object reflects the beams, and the system includes auto-focus means with a quad sensor. This setup generates focus error data for each beam, allowing for precise measurement of the test object's thickness by analyzing the deviation from the calibration object.
Career Highlights
Thomas C Bristow is currently employed at Chapman Instruments, Inc., where he continues to develop and refine measurement technologies. His work has been instrumental in enhancing the accuracy of wafer thickness measurements, which are critical in various industrial applications.
Collaborations
Bristow has collaborated with notable colleagues, including Shu W Wang and John E Stephan. Their combined expertise has contributed to the successful development of innovative measurement solutions.
Conclusion
Thomas C Bristow's contributions to the field of wafer thickness measurement exemplify the impact of innovative thinking in technology. His patents reflect a commitment to advancing measurement techniques, ensuring greater accuracy and efficiency in various applications.