This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Comsense Technologies, Ltd.. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001
Title: Thomas B Templeton: Innovator in Integrated Circuit Protection
Introduction
Thomas B Templeton is a notable inventor based in Fremont, CA (US). He has made significant contributions to the field of integrated circuit protection, particularly through his innovative patent. His work is characterized by a focus on enhancing the durability and functionality of smart cards.
Latest Patents
Thomas B Templeton holds a patent for a "Reinforced micromodule." This invention features a reinforcement structure designed to protect an integrated circuit module located within a card-type data carrier or smart card. The reinforcement structure is rigid and has a modulus of elasticity that exceeds that of the smart card. It is designed with a thickness that matches the smart card, ensuring seamless integration. The structure includes a cavity for housing the integrated circuit module and is constructed from thermally and electrically conductive materials, allowing for the integration of additional electronic circuit elements. In one embodiment, the structure is shaped like a SIMM card, replacing the typically flexible plastic SIMM card body.
Career Highlights
Thomas B Templeton is associated with Comsense Technologies, Ltd., where he has applied his expertise in developing innovative solutions for electronic devices. His work has contributed to advancements in the reliability and performance of smart card technology.
Collaborations
Thomas has collaborated with notable colleagues, including Thomas H Templeton, Jr. and Charles F Horejs, Jr. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Thomas B Templeton's contributions to the field of integrated circuit protection exemplify his commitment to innovation. His patent for the reinforced micromodule showcases his ability to enhance the functionality and durability of smart cards. His work continues to influence the industry and inspire future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile