Mesa, AZ, United States of America

Thomas A Scharr


Average Co-Inventor Count = 2.7

ph-index = 4

Forward Citations = 64(Granted Patents)


Location History:

  • Tempe, AZ (US) (1983 - 1986)
  • Mesa, AZ (US) (1991 - 1994)

Company Filing History:


Years Active: 1983-1994

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Thomas A. Scharr: Innovator in Flip-Chip Bonding Technology

Introduction

Thomas A. Scharr is a notable inventor based in Mesa, AZ (US), recognized for his contributions to the field of integrated circuit technology. With a total of 4 patents to his name, Scharr has made significant advancements in methods for flip-chip bonding and solder removal.

Latest Patents

Among his latest patents is the "Method for forming a flip-chip bond from a gold-tin eutectic." This innovative method facilitates the bonding of an integrated circuit die to a substrate using a gold-tin eutectic bond. The process involves securing a substrate with conductive bonding areas coated with tin to a flip-chip bonding apparatus, where an integrated circuit die with gold bumps is also secured. The result is a reliable bond between the die and the substrate.

Another significant patent is the "Device for solder removal." This device features a plurality of columnar structures made of solderable metal, which are used to effectively remove solder from a substrate surface. The design allows for capillary action to take place between the columns, ensuring efficient solder removal. Additionally, the device may include a standoff to prevent solder residue from remaining on the substrate surface.

Career Highlights

Thomas A. Scharr is currently associated with Motorola Corporation, where he continues to innovate in the field of electronics. His work has contributed to the advancement of technologies that are essential in modern electronic devices.

Collaborations

Throughout his career, Scharr has collaborated with notable colleagues, including Vern H. Winchell, II and Russell Thomas Lee. These collaborations have further enriched his contributions to the field.

Conclusion

Thomas A. Scharr's innovative work in flip-chip bonding and solder removal has made a significant impact on the electronics industry. His patents reflect a commitment to advancing technology and improving manufacturing processes.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…