Motorola Corporation

Thomas A Scharr

Vern H Winchell, Ii

William H Lytle

Lowell E Clark

Ravichandran Subrahmanyan

Russell Thomas Lee

Jay J Liu

A method for flip-chip bonding an integrated circuit die to a substrate. A substrate (21) having conductive bonding areas (22) coated with tin (23) is secured to a bottom end effector of a flip-chip bonding apparatus. An integrated circuit die (26) having gold bumps (28) is secured to a die tool of the flip-chip bonding apparatus. A gold-tin eutectic bond is formed between the integrated circuit die (26) and the conductive bonding areas (22) of the substrate (21).

Method for forming a flip-chip bond from a gold-tin eutectic

A device having a plurality of columnar structures comprised of a solderable metal disposed on a supporting base is used to remove solder from a substrate surface. Capillary action takes place in the area between the columns, thus removing the solder from the substrate surface. The present invention may be fabricated by forming columnar structures on the supporting base through mask openings or by etching a solderable metal layer into columnar structures. A standoff may be built into the device to prevent solder residue from remaining on the substrate surface between solder pads and to allow a controllable amount of solder to be left on the substrate surface.

Device for solder removal

Structure and process for providing a hard metallic leadframe directly bonded to a semiconductor chip without the necessity for solder or soft intermediate leadframes. The structure provides a strong bond at the semiconductor chip with the possibility for multiple simultaneous lead attachment of a leadframe having sufficient strength to serve as the external leads. The bonded structure may be conventionally encapsulated in a plastic or ceramic package, or may be glassed to provide a minimum volume hermetic chip.

Semiconductor chip with direct-bonded external leadframe

An elevated bonding pad suitable for wire or lead frame attachment and having an insulating layer completely over its outer periphery. The structure simplifies the processing required to form an elevated bonding pad, and serves to protect the periphery against bonding damage, and provides protection against corrosion of the bonded encapsulated semiconductor unit.

Growing community of inventors

Mesa, AZ, United States of America

Thomas A Scharr