Herk-de-Stad, Belgium

Thijs Vandenryt

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignees: Imec Vzw, Universiteit Hasselt. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Thijs Vandenryt. Retrieved from https://idiyas.com/inventor/thijs-vandenryt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Thijs Vandenryt: Innovator in Electronic Assemblies

Introduction

Thijs Vandenryt is a notable inventor based in Herk-de-Stad, Belgium. He has made significant contributions to the field of electronic assemblies, particularly through his innovative patent.

Latest Patents

Thijs Vandenryt holds a patent for an invention titled "Interconnect, an electronic assembly and a method for manufacturing an electronic assembly." This invention involves an interconnect designed to connect a first electronic circuit to a second, external stretchable electronic circuit device. The interconnect features conductive lines arranged in a plane, connectors that define an overlap between conductive lines and stretchable conductive lines, and an anchoring structure that provides stability to the assembly.

Career Highlights

Throughout his career, Thijs has worked with prominent organizations such as Imec Vzw and Universiteit Hasselt. His experience in these institutions has allowed him to develop and refine his innovative ideas in electronic technology.

Collaborations

Thijs has collaborated with notable colleagues, including Steven Nagels and Wim Deferme. Their teamwork has contributed to advancements in the field of electronics.

Conclusion

Thijs Vandenryt is a distinguished inventor whose work in electronic assemblies showcases his innovative spirit and dedication to advancing technology. His contributions are valuable to the field and highlight the importance of collaboration in innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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