Phoenixville, PA, United States of America

Thien Dang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Kenvue Brands LLC. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Thien Dang. Retrieved from https://idiyas.com/inventor/thien-dang-lgwi7rwb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Thien Dang and His Blister-Opening Invention.

Introduction

Thien Dang is an inventor associated with Phoenixville, Pennsylvania, and Kenvue Brands LLC. His patent work addresses a practical challenge in medication packaging: making blister packs easier for users to open.

Latest Patents

Dang is credited with 1 patent, titled “Opening for a Blister Package.” The invention describes a blister card package with a container sheet, a laminated cover sheet, and a well that holds medication. A pattern of slits forms a notch-making tab beside the blister. Its paired legs have converging ends separated by about 0.1 to 1 millimeter, while their diverging ends remain spaced from the blister pack’s edge. This arrangement is designed to help users open the package more easily. The patent also describes methods for opening blister card packages.

Career Highlights

Dang’s documented patent contribution focuses on improving the usability of blister packaging. His work connects package design with the everyday needs of people accessing medication.

Collaborations

The provided information associates Dang with Kenvue Brands LLC. No additional details about collaborators or the development process were provided.

Conclusion

Thien Dang’s blister-package patent presents a targeted design improvement intended to make medication packaging easier to open.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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