Company Filing History:
Years Active: 2021
Title: Thian Hwee Tan: Innovator in Semiconductor Packaging
Introduction
Thian Hwee Tan is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor packaging. His innovative approach has led to the development of reliable semiconductor packages, which are essential in modern electronics.
Latest Patents
Thian Hwee Tan holds a patent for a method of forming a semiconductor package. This method involves providing a package substrate with specific features, including a die attach region. A die is attached to this region, and a protective cover is applied to enhance the reliability of the semiconductor package. The patent emphasizes the importance of adhesion and protection in semiconductor technology.
Career Highlights
Thian Hwee Tan is currently employed at Utac Headquarters Pte. Ltd., where he continues to advance his work in semiconductor technology. His expertise has made significant impacts in the industry, particularly in the development of reliable packaging solutions.
Collaborations
Throughout his career, Thian Hwee Tan has collaborated with esteemed colleagues, including Hua Hong Tan and Chee Kay Chow. These collaborations have fostered innovation and contributed to the success of various projects in the semiconductor field.
Conclusion
Thian Hwee Tan's work in semiconductor packaging exemplifies the importance of innovation in technology. His contributions continue to shape the future of electronics, ensuring reliability and efficiency in semiconductor applications.