Milan, Italy

Teyi Kung

This inventor holds 1 USPTO granted patent. Top assignee: Università Degli Studi Di Trento. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teyi Kung. Retrieved from https://idiyas.com/inventor/teyi-kung-mk6b5emx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Teyi Kung - Innovator in Stackable Container Technology

Introduction

Teyi Kung is a notable inventor based in Milan, Italy. He has made significant contributions to the field of container technology, particularly with his innovative design of stackable containers. His work is recognized for its practicality and efficiency in storage solutions.

Latest Patents

Teyi Kung holds a patent for a stackable container, which showcases his ability to create functional and space-saving designs. This patent reflects his commitment to improving everyday products through innovative thinking. He has 1 patent to his name, highlighting his contributions to the field.

Career Highlights

Currently, Teyi Kung is affiliated with the Università degli Studi di Trento, where he continues to engage in research and development. His role at the university allows him to collaborate with other experts and contribute to academic advancements in technology.

Collaborations

Teyi Kung has worked alongside notable colleagues such as Fabio Massacci and Matthias Caretta Crichlow. These collaborations have enriched his research and expanded the impact of his inventions.

Conclusion

Teyi Kung is a dedicated inventor whose work in stackable container technology exemplifies innovation in practical design. His contributions to the field are significant, and his ongoing research promises to yield further advancements in container solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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