Annaka, Japan

Tetuo Yoshida


Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 12(Granted Patents)


Location History:

  • Annaka, JP (1982)
  • Gunma, JP (1988)

Company Filing History:


Years Active: 1982-1988

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2 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Tetsuo Yoshida in Semiconductor Encapsulation

Introduction

Tetsuo Yoshida, an inventor based in Annaka, Japan, has made significant contributions to the field of semiconductor technology. With two patents to his name, he is known for innovating solutions that enhance the reliability and performance of electronic devices.

Latest Patents

Yoshida's most recent inventions focus on improving resin encapsulation techniques for semiconductor devices. His first patent details a method for resin encapsulation that addresses the issue of wrong operation in high-performance devices caused by alpha-particles emitted from radioactive impurities in conventional silica fillers. He proposes using silicon dioxide powder obtained from a volatilizable silicon compound, which is free from radioactive impurities, to solve this problem. The particle size ranges from 0.5 to 100 micrometers.

The second patent presents a novel curable epoxy resin composition designed for encapsulating electronic devices such as transistors, integrated circuits (ICs), and large-scale integration (LSI) chips. This composition includes an epoxy compound along with a novolac-type phenolic resin as a curing agent. It also incorporates organophosphine compounds as curing accelerators and an inorganic filler. This innovative formulation offers enhanced flowability during molding, improved stability in storage, and excellent electrical properties at elevated temperatures, along with moisture resistance.

Career Highlights

Yoshida's innovations have been developed while working at Shin-Etsu Chemical Co., Ltd., a leading company in materials for semiconductor manufacturing. His focus on improving electronic device encapsulation highlights his expertise and commitment to advancing technology in this critical field.

Collaborations

Throughout his career, Tetsuo has collaborated with industry peers, including notable coworkers Kiyohiro Kondow and Yuki Tateyama. These partnerships have facilitated the innovative spirit and enhanced the development of effective solutions for semiconductor encapsulation challenges.

Conclusion

Tetsuo Yoshida's work in developing advanced resin compositions demonstrates his significant role in improving semiconductor technology. His patents not only address critical issues faced by the industry but also pave the way for more reliable and efficient electronics, showcasing the impact of his innovative contributions in this important sector.

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