Tokyo, Japan

Tetsuyuki Itakura


Average Co-Inventor Count = 5.0

ph-index = 5

Forward Citations = 79(Granted Patents)


Company Filing History:

goldMedal5 out of 832,680 
Other
 patents

Years Active: 2002-2003

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5 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Tetsuyuki Itakura

Introduction

Tetsuyuki Itakura, based in Tokyo, Japan, is a prolific inventor known for his significant contributions to the field of chemical mechanical polishing (CMP). With a total of five patents to his name, Itakura's innovations play a crucial role in enhancing the performance of copper-based metal films used in various applications.

Latest Patents

Among his latest patents, Itakura has developed a novel chemical mechanical polishing slurry designed specifically for polishing copper-based metal films. This invention includes a unique combination of polishing material, oxidizing agent, water, and specialized compounds like benzotriazole and triazole. The resulting polishing slurry is effective in forming reliable damascene electrical connections, providing excellent electrical properties and a higher polishing rate while minimizing dishing.

Another of Itakura's notable innovations is the creation of a slurry for CMP that incorporates a polishing grain, an oxidizing agent, and a basic amino acid compound. This formulation effectively reduces dishing and erosion during the CMP process for buried interconnections of copper-based metals on tantalum-based barrier films. These advancements are vital for ensuring the integrity and performance of electronic components.

Career Highlights

Throughout his career, Tetsuyuki Itakura has demonstrated an unwavering commitment to innovation in the field of material science. His patents reflect a deep understanding of the complex interactions involved in CMP processes, showcasing his ability to address industry challenges through technical solutions.

Collaborations

Itakura has worked alongside distinguished colleagues, including Yasuaki Tsuchiya and Tomoko Wake. Their collaborations have contributed to the advancement of CMP technologies, further solidifying the impact of their collective expertise on the industry.

Conclusion

In conclusion, Tetsuyuki Itakura's inventive spirit and dedication to innovation have led to significant advancements in chemical mechanical polishing technologies. His contributions not only enhance electrical performance but also improve manufacturing efficiency in electronics, making him a pivotal figure in this field.

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