Tetsuya Okamoto

Title: Tetsuya Okamoto: Innovator in Member Bonding Technology

Introduction

Tetsuya Okamoto is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of bonding technology, particularly through his innovative patent that enhances the precision of member bonding processes.

Latest Patents

Tetsuya Okamoto holds a patent for a member bonding apparatus. This invention provides a solution for accurately positioning two members for bonding. The apparatus includes a member alignment preprocessing device that adjusts to align one of the two members in the X and Y-axis directions. This ensures that the bonding surfaces of the two members approximately correspond. An adhesive application device applies adhesive to the bonding surface of one of the members that has been aligned. Furthermore, a member alignment device adjusts to align the other member with the first member in the X, Y, Z-axis, and α, β, θ-axis directions. This alignment is based on images captured by a CCD camera, ensuring that the bonding surfaces correspond accurately. Finally, the member bonding device bonds the surfaces together through the adhesive, while a member delivery device unloads and delivers the bonded member.

Career Highlights

Tetsuya Okamoto is associated with Origin Electric Company, Limited, where he continues to develop innovative solutions in bonding technology. His work has been instrumental in advancing the efficiency and accuracy of bonding processes in various applications.

Collaborations

Tetsuya collaborates with talented coworkers, including Koji Yamaguchi and Yutaka Matsumoto. Their combined expertise contributes to the innovative environment at Origin Electric Company, Limited.

Conclusion

Tetsuya Okamoto's contributions to member bonding technology exemplify the impact of innovation in engineering. His patent reflects a commitment to enhancing precision in manufacturing processes.