Tokyo, Japan

Tetsuya Morino

This inventor holds 1 USPTO granted patent. Top assignee: Honda Motor Ltd., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tetsuya Morino. Retrieved from https://idiyas.com/inventor/tetsuya-morino-t2o9330c

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tetsuya Morino and Vehicle Front-End Design

Introduction

Tetsuya Morino is an inventor based in Tokyo, Japan, associated with Honda Motor Co., Ltd. His patent concerns vehicle front-end construction, with particular attention to guiding airflow and protecting a sensor.

Latest Patents

Morino is credited with 1 patent: “Vehicle body front construction.” The design includes an opening in the front bumper and an air guide member behind it that directs incoming outside air rearward. A sensor is attached to the bumper, while a protection member is positioned between the sensor and the air guide member. Its protection wall extends across the vehicle’s width with clearance from the air guide member, and a side wall extends forward from the protection wall toward the bumper. This arrangement addresses the placement and protection of a sensor alongside the airflow path.

Career Highlights

The available information associates Morino’s patent work with Honda Motor Co., Ltd. His documented invention focuses on integrating airflow guidance and sensor protection into a vehicle’s front structure.

Collaborations

Masaki Mori and Momoka Fujii are identified as Morino’s coworkers. The provided information does not specify their roles in the patent.

Conclusion

Tetsuya Morino’s recorded patent presents a vehicle front construction that combines an air guide with a protective structure for a bumper-mounted sensor.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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