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For the Inventor, By the Inventor

Kaga, Japan

Tetsuya Kabata

This inventor holds 10 USPTO granted patents. Top assignees: Komatsu Industries Corporation, Komatsu Corporation. Active years: 2001-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tetsuya Kabata. Retrieved from https://idiyas.com/inventor/tetsuya-kabata

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 60.0

Average Co-Inventor Count = 2.7

ph-index = 7

Forward Citations = 110(Granted Patents)


Location History:

  • Ishikawa, JP (2001 - 2003)
  • Kaga, JP (2003 - 2006)
  • Komatsu, JP (2006 - 2011)

Company Filing History:

goldMedal9 out of 115 
 
Komatsu Industries Corporation
 patents
silverMedal1 out of 2,813 
 
Komatsu Corporation
 patents

Years Active: 2001-2011

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10 patents (USPTO):Explore Patents
1. 7960669 - Hybrid thermal cutting apparatus (2011-06-14),
2. 7087855 - Plasma cutting apparatus and control unit thereof (2006-08-08),
3. 7084368 - Thermal cutting machine and cutting method using same (2006-08-01),
4. 7067762 - Plasma cutting process and machine (2006-06-27),
5. 6933463 - Main arc ignition device and main arc ignition control method of plasma cutting machine (2005-08-23),
6. 6933462 - Plasma processing apparatus for monitoring and storing lifetime usage data of a plurality of interchangeable parts (2005-08-23),
7. 6914209 - Plasma arc machining method (2005-07-05),
8. 6664495 - Thermal cutting machine and dust collecting method thereof (2003-12-16),
9. 6583378 - Plasma machining electrode and plasma machining device (2003-06-24),
10. 6222154 - Plasma cutting method and device with the use of a plasma torch (2001-04-24),

Title: Tetsuya Kabata: Innovator in Thermal Cutting Technology

Introduction

Tetsuya Kabata is a prominent inventor based in Kaga, Japan, known for his significant contributions to thermal cutting technology. With a total of 10 patents to his name, Kabata has developed innovative solutions that enhance the efficiency and quality of cutting processes in various manufacturing applications.

Latest Patents

One of Kabata's latest inventions is the hybrid thermal cutting apparatus. This apparatus integrates both a laser head and a plasma torch, allowing for independent control of each component. This dual functionality enables the apparatus to perform both laser and plasma processing, ultimately reducing running costs for manufacturers. The apparatus categorizes cutting lines based on various factors, such as cutting length, product size, and required process accuracy. Laser cutting lines are executed through laser processing, while plasma cutting lines utilize plasma processing.

Another notable patent is the plasma cutting apparatus and its control unit. This invention significantly improves the cutting quality of products, particularly in hole cutting applications. The control unit manages the plasma cutting apparatus by adjusting the cutting speed, arc current, and plasma gas flow rate based on the specific cutting task. This ensures optimal performance and quality, especially when creating holes in plate materials.

Career Highlights

Throughout his career, Tetsuya Kabata has worked with reputable companies, including Komatsu Industries Corporation and Komatsu Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in cutting technology.

Collaborations

Kabata has collaborated with notable colleagues such as Yoshihiro Yamaguchi and Takahiro Iriyama. These partnerships have fostered innovation and the development of cutting-edge technologies in the field.

Conclusion

Tetsuya Kabata's work in thermal cutting technology exemplifies the impact of innovation on manufacturing processes. His patents reflect a commitment to enhancing efficiency and quality in cutting applications. Kabata's contributions continue to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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