Tetsuya Fukui

Title: Tetsuya Fukui: Innovator in Semiconductor Technology

Introduction

Tetsuya Fukui is a prominent inventor based in Hyogo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on the development of advanced semiconductor devices and manufacturing methods.

Latest Patents

One of Tetsuya Fukui's latest patents is for a semiconductor device and method of manufacturing the same. This innovative semiconductor device comprises a semiconductor chip, a first frame, and a solder layer that bonds the solder bonding metal layer of the semiconductor chip to the first frame. Additionally, a second frame is bonded to the rear face of the semiconductor chip. The semiconductor chip includes a semiconductor substrate, a first metal layer that forms a Schottky junction with the substrate, a second metal layer primarily composed of aluminum, and a third metal layer made of molybdenum or titanium. Furthermore, a solder bonding metal layer is provided on the third metal layer, which includes at least a fourth metal layer primarily composed of nickel, iron, or cobalt.

Career Highlights

Tetsuya Fukui is associated with Kabushiki Kaisha Toshiba, a leading company in the technology sector. His work at Toshiba has allowed him to push the boundaries of semiconductor technology and contribute to the advancement of electronic devices.

Collaborations

Tetsuya Fukui has collaborated with Mitsuru Watanabe, another expert in the field. Their partnership has fostered innovation and development in semiconductor technologies.

Conclusion

Tetsuya Fukui's contributions to semiconductor technology through his patents and work at Toshiba highlight his role as a key innovator in the industry. His advancements continue to influence the future of electronic devices and semiconductor manufacturing.