Sendai, Japan

Tetsuro Yoshida

This inventor holds 1 USPTO granted patent. Top assignee: Tohoku University. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tetsuro Yoshida. Retrieved from https://idiyas.com/inventor/tetsuro-yoshida

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Tetsuro Yoshida: Innovator in Etching Technology

Introduction

Tetsuro Yoshida is a prominent inventor based in Sendai, Japan. He is known for his contributions to the field of etching technology, particularly through his innovative patent for an ultra high-speed wet etching apparatus. His work has significant implications for various industrial applications.

Latest Patents

Tetsuro Yoshida holds a patent for an ultra high-speed wet etching apparatus. This invention features an etching method that utilizes an apparatus with four arms positioned to create an angle difference of approximately 90 degrees from the center of the stage to the peripheral portion. The etching process involves supplying etchant to a rotating object from strategically placed nozzles on the arms, enhancing the efficiency and effectiveness of the etching process.

Career Highlights

Yoshida is affiliated with Tohoku University, where he continues to engage in research and development in the field of etching technology. His academic background and innovative spirit have positioned him as a key figure in advancing etching methods.

Collaborations

Some of his notable coworkers include Teppei Uchimura and Kazuhiro Yoshikawa. Their collaborative efforts contribute to the ongoing research and development in the field.

Conclusion

Tetsuro Yoshida's work in etching technology exemplifies the innovative spirit of modern inventors. His contributions are paving the way for advancements in industrial applications, showcasing the importance of research and collaboration in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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