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For the Inventor, By the Inventor

Bothell, WA, United States of America

Tetsuro Oishi

This inventor holds 16 USPTO granted patents and 4 published patent applications and 2 EPO patents. Top assignees: Meta Platforms, Inc., Meta Platforms Technologies, LLC. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tetsuro Oishi. Retrieved from https://idiyas.com/inventor/tetsuro-oishi-rr3hp6fc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.5

ph-index = 4

Forward Citations = 35(Granted Patents)


Company Filing History:

goldMedal15 out of 9,905 
 
Meta Platforms, Inc.
 patents
silverMedal1 out of 259 
 
Meta Platforms Technologies, LLC
 patents

Years Active: 2020-2026

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16 patents (USPTO):Explore Patents
1. 12567428 - Contact transducer based audio enhancement (2026-03-03),
2. 12002483 - Systems and methods for reducing wind noise (2024-06-04),
3. 11770670 - Generating spatial audio and cross-talk cancellation for high-frequency glasses playback and low-frequency external playback (2023-09-26),
4. 11743648 - Control leak implementation for headset speakers (2023-08-29),
5. 11743640 - Privacy setting for sound leakage control (2023-08-29),
6. 11711645 - Headset sound leakage mitigation (2023-07-25),
7. 11540055 - Control leak implementation for headset speakers (2022-12-27),
8. 11308972 - Systems and methods for reducing wind noise (2022-04-19),
9. 11212606 - Headset sound leakage mitigation (2021-12-28),
10. 11202145 - Speaker assembly for mitigation of leakage (2021-12-14),
11. 11178481 - Ear-plug assembly for hear-through audio systems (2021-11-16),
12. 11171621 - Personalized equalization of audio output based on ambient noise detection (2021-11-09),
13. 10893357 - Speaker assembly for mitigation of leakage (2021-01-12),
14. 10812896 - High compliance microspeakers for vibration mitigation in a personal audio device (2020-10-20),
15. 10771888 - Ear-plug assembly for hear-through audio systems (2020-09-08),

Title: Tetsuro Oishi: Innovator in Acoustic Technology

Introduction

Tetsuro Oishi is a prominent inventor based in Bothell, WA (US), known for his contributions to acoustic technology. With a total of 16 patents, Oishi has made significant advancements in systems designed to enhance audio experiences.

Latest Patents

Oishi's latest patents include innovative systems and methods for reducing wind noise. This technology involves a system that utilizes processors connected to a non-transitory computer-readable storage medium. The system is designed to obtain signals from multiple microphones, analyze the coherence between these signals, and create a filter to minimize wind noise. Another notable patent focuses on generating spatial audio and cross-talk cancellation for wearable audio devices. This system allows for the presentation of high-frequency audio through the device's speakers while managing low-frequency audio through external speakers, utilizing personalized models for optimal sound delivery.

Career Highlights

Throughout his career, Tetsuro Oishi has worked with leading companies in the technology sector, including Facebook Technologies, LLC and Meta Platforms Technologies, LLC. His work has significantly impacted the development of audio technologies, making him a key figure in the field.

Collaborations

Oishi has collaborated with talented individuals such as Gelmont Rios and Alan Ng, contributing to the advancement of innovative audio solutions.

Conclusion

Tetsuro Oishi's work in acoustic technology showcases his dedication to improving audio experiences through innovation. His patents reflect a commitment to enhancing sound quality and user experience in various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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