Tetsuo Tsukamoto

Title: Tetsuo Tsukamoto: Innovator in Metal-Bonding Adhesive Compositions

Introduction

Tetsuo Tsukamoto is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of adhesive technology, particularly with his innovative metal-bonding adhesive compositions. His work has implications for various industries, including packaging and manufacturing.

Latest Patents

Tetsuo Tsukamoto holds a patent for a metal-bonding adhesive composition. This composition consists of 95 - 60% by weight of an aliphatic homopolyamide and 5 - 40% by weight of an aliphatic copolyamide. The homopolyamide is a crystalline substance with up to 14 amide groups per 100 carbon atoms. The copolyamide includes a polyamide with similar characteristics and another polyamide with different recurring units. This adhesive is designed to bond metallic can bodies effectively.

Career Highlights

Tsukamoto is associated with Toyo Seikan Kaisha, Ltd., a prominent company in the packaging industry. His work at the company has allowed him to focus on developing advanced adhesive solutions that enhance product durability and performance.

Collaborations

He has collaborated with notable colleagues, including Hiroshi Ueno and Shinya Otsuka. Their combined expertise has contributed to the successful development of innovative adhesive technologies.

Conclusion

Tetsuo Tsukamoto's contributions to adhesive technology, particularly through his patented metal-bonding adhesive compositions, highlight his role as an influential inventor in the industry. His work continues to impact various sectors, showcasing the importance of innovation in material science.