The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 1978

Filed:

Jul. 13, 1972
Applicant:
Inventors:

Hiroshi Ueno, Kawasaki, JP;

Shinya Otsuka, Tokyo, JP;

Tetsuo Tsukamoto, Tokyo, JP;

Akira Kishimoto, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
2608 / ; 156331 ; 428424 ;
Abstract

A metal-bonding adhesive composition consisting essentially of 95 - 60% by weight, based on the total composition, of an aliphatic homopolyamide and 5 - 40% by weight, based on the total composition, of an aliphatic copolyamide, said homopolyamide being a crystalline homopolyamide having up to 14 amide groups per 100 carbon atoms, and said copolyamide consisting of 90 - 70% by weight of (1) a polyamide having up to 14 amide groups per 100 carbon atoms and 10 - 30% by weight of (2) at least one polyamide whose recurring units are different from those of said polyamide (1), and a metallic can body composed of a metal blank, both side end portions of which are bonded by the side-lap-seam interposed by a layer of said adhesive composition.


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