Tetsuo Okuyama

Title: Tetsuo Okuyama: Innovator in Grinding Technology

Introduction

Tetsuo Okuyama is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of grinding technology, holding three patents that showcase his innovative approach to workpiece processing.

Latest Patents

Okuyama's latest patents include a working apparatus that features a finishing grindstone member fixed to a spindle by a bolt. This spindle contains a tool mounting portion designed to accommodate a rough grindstone member. Additionally, a cover member can be mounted to prevent contamination during the finish grinding of silicone wafers. Another patent describes a method and apparatus for grinding a workpiece, which involves rotating a circular thin plate while using disk-shaped rotating grinding wheels for both rough and finish grinding. This dual functionality allows for efficient processing at the same station.

Career Highlights

Tetsuo Okuyama is associated with Nippei Toyama Corporation, where he has applied his expertise in grinding technology. His work has contributed to advancements in manufacturing processes, particularly in the semiconductor industry.

Collaborations

Okuyama has collaborated with notable coworkers, including Shirou Murai and Toyotaka Wada, enhancing the innovative capabilities of their team.

Conclusion

Tetsuo Okuyama's contributions to grinding technology reflect his dedication to innovation and efficiency in manufacturing processes. His patents demonstrate a commitment to improving workpiece processing techniques, making a lasting impact in his field.