Nippei Toyama Corporation

Tetsuo Okuyama

Shirou Murai

Toyotaka Wada

Mitsuru Nukui

Kenichiro Nishi

Kazuo Nakajima

Michihiro Takata

Muneaki Kaga

Tomoyuki Kawatsu

Kunihiro Saita

Tomio Nakagawa

A finishing grindstone member ( ) is fixed to a spindle ( ) by a bolt. In the spindle ( ), there is formed a tool mounting portion ( ) into which a rough grindstone member can be mounted. Into the tool mounting portion ( ), there can be mounted not only the rough grindstone member but also a cover member ( ). After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member ( ), the cover member ( ) is mounted onto the tool mounting portion ( ) to thereby prevent the tool mounting portion ( ) from being soiled.

Working apparatus

A workpiece,formed of a circular thin plate is rotated about its center as an axis L,. Each of disk-shaped rotating grinding wheels,and,, while being rotated about an axis L,extending in a direction substantially parallel to the plane of the workpiece,and perpendicular to the radial direction of the workpiece,, is made to undergo relative feeding movement on both obverse and reverse surface sides of the workpiece,along an outer peripheral edge portion,of the workpiece,. Consequently, the outer peripheral edge portion,of the workpiece,is ground by an outer peripheral surface of each of the rotating grinding wheels,and,. In this case, it is preferred that two grinding wheels,and,for rough grinding and finish grinding be provided as the disk-shaped rotating grinding wheels, and that rough grinding and finish grinding are performed by the same station.

Method and apparatus for grinding a workpiece

A method of slicing an ingot wherein a pre-cut work 3 in which a holding member 2 extending over the entire length of a side surface of a cylindrical ingot 1 is bonded to the side surface of the ingot 1 is set on a slicing apparatus 4, and the pre-cut work 3 is split into a multiplicity of pieces over its longitudinal direction so as to obtain disk-shaped works 5 to be ground, characterized in that a retaining member 2 is used in which a retaining layer 7 which is directly bonded to the side surface of the ingot 1 by a first adhesive agent having an adhesive strength sufficient to receive a rotating force due to a grinding apparatus 6 in a subsequent grinding process, an intermediate layer 8 which is bonded to said retaining layer 7 in a superposed manner by a second adhesive agent whose adhesive strength deteriorates more than that of the first adhesive agent under a fixed condition, and a supporting layer 11 which is connected to said intermediate layer 8 and is connected to a supporting portion 10 of said slicing apparatus 4 are integrally superposed one on top another.

Ingot slicing method, an ingot manufacturing method and a sliced ingot

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Kanagawa, Japan

Tetsuo Okuyama