Okazaki, Japan

Tetsuji Egawa

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 1999-2025

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6 patents (USPTO):Explore Patents

Title: Tetsuji Egawa - Innovator in Cutting Technology

Introduction

Tetsuji Egawa is an inventor based in Toyota-shi, Japan. He is known for his innovative approach to cutting technology, particularly through his patent application for a cutting apparatus and method. Although he currently holds no granted patents, his work demonstrates a commitment to advancing manufacturing processes.

Latest Patent Applications

Egawa's notable patent application is titled "CUTTING APPARATUS AND CUTTING METHOD." This cutting device is designed for cutting flat workpieces and includes a nibbler that continuously punches the workpiece. The device also features a fluid spraying mechanism that sprays a fluid onto the surface of the workpiece during the cutting process. The nibbler consists of a cylindrical case and a punch with a punch blade that moves vertically within the case. Below the case, a die is positioned to facilitate the cutting process. The device is engineered to move the workpiece between the case and die while the punch continuously perforates the material. The fluid spraying device is strategically designed to discharge fluid from a spray port in alignment with the punch's approach to the die, ensuring effective lubrication and cooling during cutting.

Conclusion

Tetsuji Egawa's contributions to cutting technology reflect his innovative spirit and dedication to improving manufacturing techniques. His patent application showcases a unique approach to enhancing the efficiency and effectiveness of cutting processes.

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