Fukuoka, Japan

Tethuya Uchida

This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Denki Kabushiki Kaisha. Active years: 1988.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tethuya Uchida. Retrieved from https://idiyas.com/inventor/tethuya-uchida

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1988

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1 patent (USPTO):Explore Patents

Title: Tethuya Uchida: Innovator in Semiconductor Sealing Technology

Introduction

Tethuya Uchida is a notable inventor based in Fukuoka, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the area of sealing methods. His innovative approach has led to the development of a unique apparatus that enhances the efficiency and effectiveness of semiconductor element sealing.

Latest Patents

Tethuya Uchida holds a patent for an "Apparatus for sealing a semiconductor element in a resin." This invention features a plunger that injects a resin pellet into the cavities of both upper and lower molds. The plunger is driven by a reciprocating mechanism through a flexible transmission member, allowing for non-parallel movement between the plunger and the mechanism. The preferred embodiment utilizes a ball screw mechanism powered by a servomotor, with a roller chain that is slidably positioned within the lower mold. Additionally, the lower mold can be longitudinally divided into multiple sections for easier manufacturing and disassembly. A ventilating mechanism is also included to circulate cooling air along the roller chain during the molding process, preventing damage from heat.

Career Highlights

Tethuya Uchida is associated with Mitsubishi Electric Corporation, where he has applied his expertise in semiconductor technology. His work has been instrumental in advancing the methods used in the industry, particularly in the sealing processes that are critical for semiconductor performance.

Collaborations

Throughout his career, Tethuya has collaborated with notable colleagues such as Minoru Tanaka and Toru Kidera. These partnerships have fostered innovation and have contributed to the successful development of new technologies in the semiconductor field.

Conclusion

Tethuya Uchida's contributions to semiconductor sealing technology exemplify the importance of innovation in the industry. His patented apparatus not only improves manufacturing processes but also enhances the reliability of semiconductor elements. His work continues to influence the field and showcases the impact of dedicated inventors in advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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