Location History:
- Kanuma, JP (2006)
- Utsunomiya, JP (2007)
Company Filing History:
Years Active: 2006-2007
Title: Teruyuki Akiyama: Innovator in Resin Foam Technology
Introduction
Teruyuki Akiyama is a notable inventor based in Utsunomiya, Japan. He has made significant contributions to the field of resin foam technology, holding 2 patents that showcase his innovative approaches to material production.
Latest Patents
Akiyama's latest patents include a process for producing polystyrene resin foam by extrusion. This process involves extruding a foamable composition that includes melted polystyrene resin and a physical blowing agent. The resulting polystyrene resin foam has a thickness of at least 10 mm and a transverse cross-sectional area of at least 50 cm. The extrusion is performed to achieve a specific molecular weight ratio, ensuring high-quality foam production.
Another significant patent is for a polypropylene resin hollow molded foam article and the process for its production. This invention utilizes multiple polypropylene resins as the base material, resulting in a hollow molded foam article with a foam layer. The production process involves positioning a softened cylindrical foam in a mold, which is created from a foamable molten resin composition containing a foaming agent. The specifications of the polypropylene resins used are carefully defined to achieve optimal properties in the final product.
Career Highlights
Akiyama is currently associated with Jsp Corporation, where he continues to develop innovative solutions in resin technology. His work has contributed to advancements in the production of lightweight and durable foam materials.
Collaborations
Akiyama collaborates with talented coworkers, including Naochika Kogure and Daisuke Imanari. Their combined expertise enhances the innovative capabilities within their projects.
Conclusion
Teruyuki Akiyama's contributions to resin foam technology through his patents reflect his commitment to innovation in material science. His work continues to influence the industry and pave the way for future advancements.