The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Sep. 23, 2003
Daisuke Imanari, Kanuma, JP;
Teruyuki Akiyama, Kanuma, JP;
Naochika Kogure, Kanuma, JP;
Masato Naito, Kanuma, JP;
Daisuke Imanari, Kanuma, JP;
Teruyuki Akiyama, Kanuma, JP;
Naochika Kogure, Kanuma, JP;
Masato Naito, Kanuma, JP;
JSP Corporation, Tokyo, JP;
Abstract
The present invention relates to a hollow molded foam article in which a plurality of polypropylene resins are used as the base resin, and to a process for the production of this hollow molded foam article. More particularly, the present invention relates to a polypropylene resin hollow molded foam article having a foam layer, in which the base resin comprises (a) a polypropylene resin with a melt tension of at least 98 mN and a melt flow rate of 0.5 to 15 g/10 minutes, (b) a polypropylene resin with a melt tension of less than 30 mN (excluding O) and a melt flow rate of 2 to 30 g/10 minutes, and (c) a polypropylene resin with a melt tension of at least 30 mN and less than 98 mN and a melt flow rate of 2 to 15 g/10 minutes, formed by positioning in a mold a softened cylindrical foam having a foam layer obtained by extruding from the die of an extruder a foamable molten resin composition containing a foaming agent, wherein the melt tension at 230° C. of the polypropylene resin that forms the foam layer is at least 10 mN and less than 49 mN, and the apparent density of the foam layer is no more than 0.3 g/cm.