Hyogo, Japan

Teruo Sugimoto

This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Denki Kabushiki Kaisha. Active years: 1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teruo Sugimoto. Retrieved from https://idiyas.com/inventor/teruo-sugimoto-t1s3yclu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 1996

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1 patent (USPTO):Explore Patents

Title: Teruo Sugimoto and His Vuilleumier Heat Pump Patent.

Introduction

Teruo Sugimoto is an inventor associated with Hyogo, Japan, and Mitsubishi Denki Kabushiki Kaisha, also known as Mitsubishi Electric Corporation. His patent work includes an invention concerning the design and operation of a Vuilleumier heat pump.

Latest Patents

Sugimoto is credited with 1 patent. His patent, “Vuilleumier Heat Pump,” describes hot and cold displacers supported by coil springs in separate buffer chambers. The design uses pressure differences between the working gas and the buffer chambers to create forced vibration of the displacers, while a linear motor drives the hot displacer in reciprocating motion. The approach aims to simplify and reduce the size of the displacer-driving mechanism while allowing greater flexibility in the arrangement of the hot and cold cylinders.

Career Highlights

Sugimoto’s recorded patent contribution focuses on a mechanical system for driving the displacers in a Vuilleumier heat pump. The invention addresses both the structure of the drive mechanism and the placement of the heat pump’s cylinders.

Collaborations

The patent record names Tetsuya Honda and Takuya Suganami as Sugimoto’s coworkers.

Conclusion

Teruo Sugimoto’s patent presents a compact, simplified approach to driving the displacers of a Vuilleumier heat pump, with the potential to ease constraints on cylinder arrangement.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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