Sanda, Japan

Teruki Hyougatani


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 1995-1996

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2 patents (USPTO):Explore Patents

Title: Teruki Hyougatani: Innovator in Semiconductor Technology

Introduction

Teruki Hyougatani is a notable inventor based in Sanda, Japan. He has made significant contributions to the field of semiconductor technology. With a focus on improving the efficiency and cost-effectiveness of semiconductor devices, Hyougatani has been instrumental in advancing this critical area of innovation.

Latest Patents

Hyougatani holds 2 patents related to semiconductor devices. His latest patents include a semiconductor device and resin for sealing a semiconductor device. The first patent discloses a semiconductor device where electrode terminals, elements, and wires are disposed on a base plate of a case filled with only epoxy resin. The epoxy resin contains impurities such as halogen and alkaline metallic salts in an amount of not more than 5 ppm and has a linear expansion coefficient of 5.times.10.sup.-6 to 25.times.10.sup.-6 when hardened. This design allows for direct sealing of the components, thereby reducing both size and cost. The second patent also focuses on a semiconductor device with similar features, emphasizing the benefits of direct sealing for efficiency and cost reduction.

Career Highlights

Hyougatani is associated with Mitsubishi Denki Kabushiki Kaisha, a leading company in the electronics and semiconductor industry. His work has contributed to the company's reputation for innovation and quality in semiconductor technology.

Collaborations

Hyougatani has collaborated with notable coworkers such as Shinobu Takahama and Akinobu Tamaki. Their combined expertise has further enhanced the development of advanced semiconductor solutions.

Conclusion

Teruki Hyougatani's contributions to semiconductor technology exemplify the importance of innovation in this field. His patents reflect a commitment to improving device efficiency and reducing costs, making a significant impact on the industry.

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