This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Toshiba Kikai Kabushiki Kaisha. Active years: 2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2020
Title: Terukatsu Kuboki: Innovator in Molded Body Assembly Technology
Introduction
Terukatsu Kuboki is an inventor based in Numazu-shi, Japan. He has made contributions to the field of molded body assembly technology. Although he currently holds no granted patents, his innovative ideas are reflected in his patent applications.
Latest Patent Applications
One of his notable patent applications is titled "MOLDED BODY ASSEMBLY, APPARATUS FOR MANUFACTURING THE MOLDED BODY ASSEMBLY, AND METHOD OF MANUFACTURING AND USING THE MOLDED BODY ASSEMBLY." This application describes a molded body assembly that includes a to-be-molded body and a mold formed in the shape of a sheet. The mold features a fine transfer pattern on one surface, which adheres to the to-be-molded body through the transfer of this pattern. This process protects the fine transferred pattern formed in the to-be-molded body.
Conclusion
Terukatsu Kuboki's work in molded body assembly technology showcases his innovative spirit and potential for future contributions to the field. His patent application reflects a unique approach to manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile