Chiba, Japan

Teruhisa Obata

This inventor holds 1 USPTO granted patent. Top assignee: Mabuchi Motor Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teruhisa Obata. Retrieved from https://idiyas.com/inventor/teruhisa-obata

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Teruhisa Obata: Innovator in Packaging Structures

Introduction

Teruhisa Obata is a notable inventor based in Chiba, Japan. He has made significant contributions to the field of packaging technology. His innovative designs focus on enhancing the functionality and efficiency of packaging structures.

Latest Patents

Obata holds a patent for a unique packaging structure. This packaging structure includes a box designed to accommodate a component, featuring a lower layer tray and a middle layer tray made from a cardboard sheet. The lower layer tray is positioned inside the box, while the middle layer tray is placed above it. The design includes specific openings and tabs that secure the component effectively, showcasing Obata's ingenuity in packaging solutions.

Career Highlights

Obata is associated with Mabuchi Motor Co., Ltd., where he has applied his expertise in developing innovative packaging solutions. His work has contributed to the company's reputation for quality and efficiency in product delivery.

Collaborations

Obata has collaborated with notable colleagues, including Kunio Inoue and Ryo Okuyama. These partnerships have fostered a creative environment that encourages innovation and the development of new ideas.

Conclusion

Teruhisa Obata's contributions to packaging technology exemplify his commitment to innovation. His patent reflects a deep understanding of practical design, making a significant impact in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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