Osaka, Japan

Teruhiko Yamamoto

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Hakko Corporation. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teruhiko Yamamoto. Retrieved from https://idiyas.com/inventor/teruhiko-yamamoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2021

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Teruhiko Yamamoto: Innovator in Solder Handling Technology

Introduction: Teruhiko Yamamoto is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of solder handling technology. His innovative approach has led to the development of a unique solder feed structure that addresses common issues in soldering processes.

Latest Patents: Teruhiko Yamamoto holds a patent for a solder handling apparatus. This invention features a solder exit aperture with an elongated shape, which helps reduce the incidence of clogging. The design includes a bent segment leading up to the solder exit aperture, ensuring that the solder wire remains stable and does not wobble during operation. This innovation enhances the efficiency and reliability of soldering tasks.

Career Highlights: Teruhiko Yamamoto is associated with Hakko Corporation, a company known for its advanced soldering tools and equipment. His work at Hakko has allowed him to focus on improving solder handling techniques, contributing to the company's reputation for quality and innovation.

Collaborations: Teruhiko Yamamoto has collaborated with Hiroyuki Masaki, a fellow innovator in the field. Their partnership has fostered the development of new ideas and solutions in solder technology.

Conclusion: Teruhiko Yamamoto's contributions to solder handling technology exemplify the spirit of innovation. His patent for a solder handling apparatus demonstrates his commitment to improving soldering processes. Through his work at Hakko Corporation, he continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…