Company Filing History:
Years Active: 2016-2020
Title: Innovations by Terry Pederson
Introduction
Terry Pederson is a notable inventor based in Sunnyvale, California. She has made significant contributions to the field of substrate fabrication and chip encapsulation processing. With a total of four patents to her name, her work has advanced the technology used in these areas.
Latest Patents
Terry's latest patents include a "Wafer plate and mask arrangement for substrate fabrication." This innovative system is designed for processing wafers in a vacuum processing chamber. It features a carrier with multiple openings, each accommodating one wafer, and a transport mechanism for moving the carriers throughout the system. Additionally, the system includes a plurality of wafer plates for supporting the wafers and an attachment mechanism for securing these plates to the carriers. A mask is attached over the front side of one of the openings in the carrier, and an alignment stage supports the wafer plate under the opening. A camera is positioned to simultaneously image the mask and the wafer.
Another significant patent is the "In line fan out system." This system is designed for fan out chip encapsulation processing, where multiple microchips are encapsulated in molding compound. The system comprises an atmospheric loading chamber for loading substrates onto carriers, an entry loadlock arrangement for introducing carriers into a vacuum environment, and a degas chamber to remove gases emitted from the molding compound. It also includes an etch chamber with an ion beam generator, a metal sputtering chamber, and an exit loadlock arrangement for removing carriers from the vacuum environment.
Career Highlights
Terry Pederson works at Intevac, Inc., where she has been instrumental in developing advanced technologies for substrate fabrication and chip processing. Her innovative approaches have contributed to the efficiency and effectiveness of these processes.
Collaborations
Throughout her career, Terry has collaborated with notable colleagues, including Terry Bluck and Henry Hieslmair. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Terry Pederson's contributions to the field of substrate fabrication and chip encapsulation processing are noteworthy. Her patents reflect her commitment to innovation and her ability to solve complex engineering challenges. Through her work at Intevac, Inc., she continues to influence the industry positively.