Liverpool, NY, United States of America

Terrence S Alcorn

This inventor holds 1 USPTO granted patent. Top assignee: Martin Marietta Corporation. Active years: 1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Terrence S Alcorn. Retrieved from https://idiyas.com/inventor/terrence-s-alcorn-nvoa15gy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 48(Granted Patents)


Company Filing History:


Years Active: 1995

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1 patent (USPTO):Explore Patents

Title: Terrence S Alcorn: Innovator in Integrated Circuit Technology

Introduction

Terrence S Alcorn is a notable inventor based in Liverpool, NY (US). He has made significant contributions to the field of integrated circuits, particularly through his innovative patent related to air bridges.

Latest Patents

Terrence holds a patent for a "Process for making air bridges for integrated circuits." This invention involves a unique method for creating air bridges that enhance the functionality of integrated circuits. The process includes the use of photoresist layers to form an arch-shaped air bridge, which is crucial for connecting contacts in a more efficient manner.

Career Highlights

Terrence is associated with Martin Marietta Corporation, where he has applied his expertise in integrated circuit technology. His work has contributed to advancements in the manufacturing processes of electronic components.

Collaborations

Throughout his career, Terrence has collaborated with notable colleagues such as George C Pifer and Simon A Zaidel. These collaborations have fostered innovation and development in their respective fields.

Conclusion

Terrence S Alcorn's contributions to integrated circuit technology through his patent demonstrate his commitment to innovation. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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