This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1992.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1992
Title: Terence C. Godown: Innovator in Electronic Circuit Packaging
Introduction
Terence C. Godown is a notable inventor based in Endwell, NY (US). He has made significant contributions to the field of electronic circuit packaging. His innovative designs have led to advancements in how electronic components are assembled and connected.
Latest Patents
One of Terence's key patents is for a pluggable electronic circuit package assembly with a snap-together heat sink. This assembly is designed for use with an edge-type connector and features a two-piece heat sink housing. The housing includes internal retention posts and recesses that allow for easy assembly and disassembly. Additionally, a resilient latch secures the connector to the assembly, enhancing its functionality and reliability.
Career Highlights
Terence C. Godown is associated with International Business Machines Corporation (IBM), where he has contributed to various projects and innovations. His work has focused on improving electronic circuit designs, making them more efficient and user-friendly.
Collaborations
Throughout his career, Terence has collaborated with notable colleagues, including Joseph Funari and Scott D. Reynolds. These partnerships have fostered a creative environment that has led to successful innovations in the field.
Conclusion
Terence C. Godown's contributions to electronic circuit packaging demonstrate his commitment to innovation and excellence. His work continues to influence the industry, paving the way for future advancements in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile