Fujian, China

Tengteng Wang

This inventor holds 1 USPTO granted patent. Top assignee: Contemporary Amperex Technology (Hong Kong) Limited. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tengteng Wang. Retrieved from https://idiyas.com/inventor/tengteng-wang-uoxnw0t6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Tengteng Wang: Innovator in Conveyor Technology

Introduction

Tengteng Wang is a notable inventor based in Fujian, China. He has made significant contributions to the field of conveyor technology, particularly with his innovative designs that enhance efficiency in material handling.

Latest Patents

Tengteng Wang holds 1 patent for his invention titled "Circulating Conveyor." This invention features a unique design that includes a first conveying line and a second conveying line, both equipped with loading and unloading positions. The clamps can be circularly conveyed between these lines in either a clockwise or counterclockwise direction, facilitated by a circulating adapter that comprises two adapters arranged in pairs at both positions.

Career Highlights

Wang is currently employed at Contemporary Amperex Technology (Hong Kong) Limited, where he continues to develop innovative solutions in the field of conveyor systems. His work focuses on improving the efficiency and functionality of material handling processes.

Collaborations

Tengteng Wang collaborates with talented coworkers, including Xiang Fan and Kun Yang, who contribute to the innovative projects at their company.

Conclusion

Tengteng Wang's contributions to conveyor technology exemplify his commitment to innovation and efficiency. His patent for the circulating conveyor showcases his ability to solve complex challenges in material handling.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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