Los Angeles, CA, United States of America

Tengfei Li

This inventor holds 3 USPTO granted patents and 1 EPO patent. Top assignee: Snap Inc.. Active years: 2020-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tengfei Li. Retrieved from https://idiyas.com/inventor/tengfei-li-mnfzyidh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 8.0

ph-index = 2

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 2020-2024

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3 patents (USPTO):Explore Patents

Title: Innovations by Tengfei Li

Introduction

Tengfei Li is an accomplished inventor based in Los Angeles, CA. He has made significant contributions to the field of electronic messaging systems. With a total of 3 patents to his name, Tengfei continues to push the boundaries of technology.

Latest Patents

One of Tengfei's latest patents is an application-independent messaging system. This innovation enhances the functionality of electronic messaging software and systems. It allows senders to transmit messages and content using a messaging system, while recipients can access such messages and content, even if they do not have access to the messaging system.

Career Highlights

Tengfei Li is currently employed at Snap Inc., where he applies his expertise in developing innovative messaging solutions. His work has been instrumental in improving user experience and accessibility in digital communication.

Collaborations

Tengfei collaborates with talented individuals such as Jacob Andreou and Yansong Liu. Together, they work on advancing technologies that enhance communication.

Conclusion

Tengfei Li's contributions to electronic messaging systems demonstrate his commitment to innovation and technology. His work continues to influence the way we communicate in the digital age.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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