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For the Inventor, By the Inventor

Hsinchu, Taiwan

Teng-Sheng Chen

This inventor holds 20 USPTO granted patents and 1 EPO patent, primarily in Camera Module Technology. Top assignees: Omnivision Technologies, Inc., Visera Technologies Company Limited. Active years: 2010-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teng-Sheng Chen. Retrieved from https://idiyas.com/inventor/teng-sheng-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 37(Granted Patents)


Location History:

  • Hsinche, TW (2012)
  • Hsinchu, TW (2010 - 2024)

Company Filing History:

goldMedal18 out of 1,417 
 
Omnivision Technologies, Inc.
 patents
silverMedal5 out of 262 
 
Visera Technologies Company Limited
 patents
where one patent can have more than one assignee

Years Active: 2010-2025

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Areas of Expertise:
Endoscope Assembly
Camera Module
Image Sensor
Light-Field Camera
LED Integration
Wafer-Level Packaging
Optical Microstructure
Micro-Cable Structure
Surface-Mount Device
Light-Pipe Illuminator
Truncated Trapezoid Cavity
Slim Imager
20 patents (USPTO):Explore Patents
1. 12251081 - Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopes (2025-03-18),
2. 12064090 - Endoscope tip assembly using cavity interposer to allow coplanar camera and LEDs (2024-08-20),
3. 11943525 - Electronic camera module with integral LED and light-pipe illuminator (2024-03-26),
4. 11583171 - Surface-mount device platform and assembly (2023-02-21),
5. 11172806 - Medical micro-cable structure and connection method with mini camera cube chip (2021-11-16),
6. 11063083 - Light-shielded cameras and methods of manufacture (2021-07-13),
7. 10868945 - Light-field camera and method using wafer-level integration process (2020-12-15),
8. 10734437 - Interposer and chip-scale packaging for wafer-level camera (2020-08-04),
9. 10459189 - Lens barrel, lens-barrel wafer, and associated method (2019-10-29),
10. 10217789 - Interposer and chip-scale packaging for wafer-level camera (2019-02-26),
11. 10204947 - Cover-glass-free array camera with individually light-shielded cameras (2019-02-12),
12. 10187560 - Notched-spacer camera module and method for fabricating same (2019-01-22),
13. 10157943 - Trenched-bonding-dam device and manufacturing method for same (2018-12-18),
14. 10121820 - Protective caps for small image sensor masking and mounting process (2018-11-06),
15. 10082651 - Slim imager, associated system-in-package, and associated method (2018-09-25),

Title: Teng-Sheng Chen - Innovative Inventor from Hsinchu

Introduction: Teng-Sheng Chen is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Teng-Sheng Chen holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Teng-Sheng Chen has worked with leading tech companies and research institutions, playing a pivotal role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Teng-Sheng Chen has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge sharing to drive forward progress in the field of technology.

Conclusion: Teng-Sheng Chen's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, inspiring the next generation of innovators to push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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