Teng-Sheng Chen

This inventor holds 20 USPTO granted patents and 1 EPO patent. Top assignees: Omnivision Technologies, Inc., Visera Technologies Company Limited. Active years: 2010-2025.

USPTO Granted Patents = 20

% Patents Active = 100.0

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 37(Granted Patents)

Location History:

Hsinche, TW (2012)
Hsinchu, TW (2010 - 2024)

Company Filing History:

18 out of 1,409

Omnivision Technologies, Inc.

patents

5 out of 262

Visera Technologies Company Limited

patents

where one patent can have more than one assignee

Years Active: 2010-2025

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20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12251081 - Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopes (2025-03-18),

2. 12064090 - Endoscope tip assembly using cavity interposer to allow coplanar camera and LEDs (2024-08-20),

3. 11943525 - Electronic camera module with integral LED and light-pipe illuminator (2024-03-26),

4. 11583171 - Surface-mount device platform and assembly (2023-02-21),

5. 11172806 - Medical micro-cable structure and connection method with mini camera cube chip (2021-11-16),

6. 11063083 - Light-shielded cameras and methods of manufacture (2021-07-13),

7. 10868945 - Light-field camera and method using wafer-level integration process (2020-12-15),

8. 10734437 - Interposer and chip-scale packaging for wafer-level camera (2020-08-04),

9. 10459189 - Lens barrel, lens-barrel wafer, and associated method (2019-10-29),

10. 10217789 - Interposer and chip-scale packaging for wafer-level camera (2019-02-26),

11. 10204947 - Cover-glass-free array camera with individually light-shielded cameras (2019-02-12),

12. 10187560 - Notched-spacer camera module and method for fabricating same (2019-01-22),

13. 10157943 - Trenched-bonding-dam device and manufacturing method for same (2018-12-18),

14. 10121820 - Protective caps for small image sensor masking and mounting process (2018-11-06),

15. 10082651 - Slim imager, associated system-in-package, and associated method (2018-09-25),

Title: Teng-Sheng Chen - Innovative Inventor from Hsinchu

Introduction: Teng-Sheng Chen is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Teng-Sheng Chen holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Teng-Sheng Chen has worked with leading tech companies and research institutions, playing a pivotal role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Teng-Sheng Chen has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge sharing to drive forward progress in the field of technology.

Conclusion: Teng-Sheng Chen's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, inspiring the next generation of innovators to push the boundaries of what is possible in the world of technology.