Shenzhen, China

Teng Liu

This inventor holds 2 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignees: Huawei Digital Power Technologies Co., Ltd., Zte Corporation. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teng Liu. Retrieved from https://idiyas.com/inventor/teng-liu-oltw2y1i

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2016-2026

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Teng Liu

Introduction

Teng Liu is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of radio frequency technology. His work focuses on methods to enhance communication systems by minimizing interference between frequency bands.

Latest Patents

Teng Liu holds a patent for a "Method and system for filtering out adjacent frequency band interference." This innovative method involves an RF MEMS switch control module that receives coupling signals from different frequency band RF modules. The system determines if interference exists and filters it out by adjusting the antenna structures accordingly. This technology allows adjacent frequency bands to coexist without mutual interference, enhancing the efficiency of communication systems.

Career Highlights

Teng Liu is currently employed at ZTE Corporation, a leading telecommunications company. His role involves developing advanced technologies that improve wireless communication. His expertise in RF MEMS technology has positioned him as a key player in the industry.

Collaborations

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Conclusion

Teng Liu's innovative work in filtering adjacent frequency band interference showcases his commitment to advancing communication technology. His contributions are vital for the future of wireless systems, ensuring better performance and reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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